기술·품질

    기술로드맵

    Item Unit 2021年 2022年 ~
    MASS PROTO PROTO
    Products MLB, HDI, Green PCB
    Automotive PCB     		R-F PCB, Metal PCB,
    Filled via for HDI, High Layer Board     		Package Substrate,
    Network PCB
    Fine Pitch PCB Pitch 0.5 0.4 0.3
    Ball Pad mm 0.25 0.21 0.16
    Pattern Line/Space mm 0.070 / 0.070 0.060 / 0.060 0.050 / 0.050
    Method - Subtractive Subtractive Semi-additive
    Mice via Type - Staggered via Cu filled stack via All layer build up
    Dia. mm 0.110 0.100 0.080
    Layer - ~ L14 ~ L64 ~ L80
    Thickness mm 0.20 ~ 3.20mm 0.20mm↓ 8.00mm↑
    Layer - ENIG/OSP/HASL/Selective Gold ENIG/OSP/HASL/Selective Gold/TIN/
    Immersion Silver/ENEPIG/Soft ENIG